| Gen | 9th gen |
|---|---|
| F processor | f series |
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Processor
HEAT SINK PASTE
- Heat sink paste, also known as thermal paste or thermal compound, is a type of substance used to improve heat transfer between a heat sink and a processor.
- It is typically made of a silicone-based compound that is electrically non-conductive and designed to fill microscopic gaps between the heat sink and processor.
- By filling these gaps, heat sink paste helps to improve thermal conductivity and transfer heat away from the processor more efficiently, which can help to prevent overheating and prolong the lifespan of the device.
- Heat sink paste is typically applied in a thin layer between the heat sink and processor using a small applicator, such as a brush or syringe.
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Processor
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- Performance-cores 6
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