| Gen | 10th gen |
|---|
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Processor
HEAT SINK PASTE
- Heat sink paste, also known as thermal paste or thermal compound, is a type of substance used to improve heat transfer between a heat sink and a processor.
- It is typically made of a silicone-based compound that is electrically non-conductive and designed to fill microscopic gaps between the heat sink and processor.
- By filling these gaps, heat sink paste helps to improve thermal conductivity and transfer heat away from the processor more efficiently, which can help to prevent overheating and prolong the lifespan of the device.
- Heat sink paste is typically applied in a thin layer between the heat sink and processor using a small applicator, such as a brush or syringe.
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Processor
Intel® Core™ i5-11400 Processor 12M Cache, up to 4.40 GHz
- Total Cores6
- Total Threads12
- Max Turbo Frequency4.40 GHz
- Intel® Turbo Boost Technology 2.0 Frequency‡4.40 GHz
- Processor Base Frequency2.60 GHz
- Cache12 MB Intel® Smart Cache
- Bus Speed8 GT/s
- TDP65 W
SKU: n/a -
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Processor
Intel® Core™ i7-12700F Processor 25M Cache, up to 4.90 GHz
- Total Cores12
- Performance-cores8
- Efficient-cores4
- Total Threads20
- Max Turbo Frequency4.90 GHz
- Intel® Turbo Boost Max Technology 3.0 Frequency ‡90 GHz
- Performance-core Max Turbo Frequency4.80 GHz
- Efficient-core Max Turbo Frequency3.60 GHz
- Performance-core Base Frequency2.10 GHz
- Efficient-core Base Frequency1.60 GHz
- Cache25 MB Intel® Smart Cache
- Total L2 Cache12 MB
- Processor Base Power65 W
- Maximum Turbo Power180 W
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